9888拉斯维加斯

Technical Capability
MP batch of PCB
Range Item Capabilities
Normal Layers Count ≤36L
Board Thickness 0.30-6.0mm
Thickness Tolerance ±10%
Max PNL Size 610mm*710mm
Warpage(Min) ≤0.5%
Impedance Tolerance Differential impedance≥50Ω ±8%
Characteristic impedance≤50Ω ±10%
Stack up PP Thickness ≥ 2.0mil
Drilling Min Drilling diameter 0.15mm
Hole diameter tolerance PTH ±0.05mm
NPTH ±0.025mm
Plating Aspect Ratio of Plated Hole(Max) 30:1
Line Design Inner Layer Layers：4-10L ≥5 mil
Layers: 12-16L ≥6 mil
Inner Layer Line Width/Space Inner Layer HOZ 2.5/2.5mil
Max Base Copper Inner Layer ≤5OZ
Outer Layer ≤5OZ
Outer Layer Line Width/Space 2.6/2.6mil
Line width tolerance Impedance Line ±10%
None Imped Line ±20%
Pad Tolerance Pad≥10mil ≥±10%
Back Drill Back Drill STUB 5±3mil
BGA(Dual Lines) Back Drill Capa 37/(35)mil
Back Drill Accuracy (Hole to Hole) D+8～D+6mil
Back Drill Accuracy (Hole to Line) ≥4.2mil
Solder Mask Solder Mask Bridge ≥3mil
Solder Mask Thickness Line to Surface 10-40um
Line to Corner ≥10um
Routing Tolerance ±0.1mm
POFV Design Aspect Ratio 30:1
Line Width/Line Space 3.5/3.5mil
Special Process Asymmetry Hybrid, Skip Via（1-3）
CCL Capa M7/PTFE、ULL+FR4 Hybrid
Electrical Property SI Simulation/Analysis，SI Control（44Ghz）
Surface Treatment Gold-plated plug Gold thickness 0.127-1.0um
ENIG Gold thickness 0.03-0.10um
OSP Film thickness 0.2-0.6um
HASL lead free 1-25um
Immersion Silver 6-15u"
Immersion Tin 0.8-1.2um
Sample and Small batch of PCB
Range Item Sample batch Capa Small batch Capa
Normal Layers Count ≦108L ≦46L
Board Thickness 0.2~13.0mm 0.4~6.5mm
Thickness Tolerance ±8% ±10%
Impedance Tolerance Differential impedance≥50Ω ±8% ±10%
Characteristic impedance ≤50Ω ±2.5Ω ±5Ω
Warpage(Min) ≦0.3% ≦0.75%
Stack up PP Thickness ≧3mil ≧3mil
Drilling Min Drilling diameter 0.125mm 0.15mm
Hole diameter tolerance PTH ±0.04mm ±0.05mm
NPTH ±0.025mm ±0.05mm
Plating Aspect Ratio of Plated Hole(Max) 30:1 25:1
Line Design Inner Layer Layers: 4-10L ≥5.5mil ≥6.5mil
Layers: 12-36L ≥7mil ≥7mil
Inner Layer Line Width/Space Inner Layer HOZ 2.0mil/2.0mil 3mil/3mil
Max Base Copper Inner Layer 28OZ 6OZ
Outer Layer 28OZ 6OZ
Outer Layer Line Width/Space 30-40um 3/3mil 3/3mil
40-55um 3.5/3.5mil 4/4mil
总铜:40~55um 3.5/3.5mil 4/4mil
Line width tolerance Width≥10mil ±15μm ±1mil
Width<10mil ±10% ±10%
Pad Tolerance Pad≥12mil ±1mil ±1mil
Solder Mask Solder Mask Bridge 3.5mil 4mi
S/M Plugging Plugging diameter hole 5mil 5mil
S/M Thickness Line to surface 10~40μm 10~40μm
Line to corner ≧5μm ≧5μm
Routing Tolerance ±0.1mm ±0.1mm
Surface Treatment Gold-plated plug Gold thickness 0.127~2μm 0.127~1.25μm
Ni thickness 2.54~6μm 2.54~6μm
ENIG Gold thickness 0.03~0.2μm 0.03~0.2μm
Ni thickness 2.54~6μm 2.54~6μm
OSP Film thickness 0.2~0.6μm 0.2~0.6μm
HASL lead free 1~40μm 1~40μm
Immersion Silver 6~15u" 6~15u"
Immersion Tin 0.8~1.2μm 0.8~1.2μm
Gold Finger Gold thickness 0.127-2μm 0.127-1.25μm
Length Tolerance (Etching) ±0.15mm ±0.15mm
Length Tolerance (Solder Mask) ±0.1mm ±0.1mm
Width Tolerance ±25μm ±40μm

Surface treatment: HASL lead free, immersion gold, immersion Tin, immersion Silver, Gold Finger, Hard/Soft gold plating, OSP, ENEPlG and Selective hard gold plating.

Materials:FR4, Rogers, Arlon, Taconic, Bergguist, TUC, Panasonic M6/M7 and so on.

Special technology:Blind & buried holes, Via in pad, Castellated holes, Counterbore, Step mounting holes, Controlled depth holes, edge-plating, metal base PCB, Stepped G/F, Back-drill, Mixed RF PCB, Busbar PCB, Copper coin embedded and Ceramic coin embedded.

FPC & RFPC
No. Item Capabilities
1 Layers Count FPC：1-6L
RFPC：2-10L
2 Finished Board Size(Max) 19.7″×19.7″
3 Major CCL Brand Doosan\Thinflex\Shengyi\Taiyo\DongYi
4 Finished Board Thickness Tolerance ±0.03mm(Thickness≤ 0.2mm)
±0.05mm(0.2mm＜Thickness≤0.5mm)
5 Blind/Buried Hole YES
6 Min Drilling Hole Diameter Mech Drilling：0.1mm~6.5mm
Laser Drilling：0.1-0.125mm
7 Base copper of outer layer 1/3 OZ-2OZ (0.012mm -0.070mm)
8 Base copper of inner layer 1/3 OZ-1OZ (0.012mm -0.035mm)
9 Board Thickness 0.07mm-2.0mm
10 Aspect Ratio of Plated Hole(Max) 8:1
11 Hole Diameter Tolerance (PTH) ±3mil ( ±0.075mm)
12 Hole Diameter Tolerance (NPTH) ±1mil ( ±0.025mm)
13 Copper Thickness of PTH Wall 10um min or base on customer requirement
14 Design Line Width /Space of inner layer (Min) H/H OZ 3mil/3mil
1/1 OZ 4mil/4mil
2/2 OZ 5mil/5mil
3/3 OZ 6mil/6mil
15 Design Line Width /Space of outer layer (Min) H/H OZ 3mil/3mil
1/1 OZ 3mil/3mil
2/2 OZ 4mil/4 mil
3/3 OZ 6mil/6mil
16 Solder Mask Bridge Width (Min) 2.5mil (0.064mm)
17 Solder Mask Alignment Tolerance ±2mil (±0.05mm)
18 Coverlay Bridge Width(Min) 8mil (0.2mm)
19 Coverlay Bridge Alignment Tolerance ±6mil (±0.15mm)
20 Dimension Tolerance (Hole to Edge) ±4mil (±0.1mm)
21 Test Capacity PAD Size min (0.1mm)
PAD Pitch min (0.4mm)
22 Stiffener Type PI\FR4\SUS
23 Electromagnetic Shielding Technology Film / Silver Paste
24 Surface Treatment OSP，ENIG，Plating Gold
HDI PCB
Item 2025 2026 2027
HDI Blind Hole Structure 5+N+5 6+N+6 7+N+7
Drilling hole diameter (um) Min Blind Hole 75 75 75
Min Buried Hole 150 150 150
Min Through Hole 150 150 150
Max Aspect Ratio Laser Blind Hole 1 ：1 1.2 ：1 1.2 ：1
Through Hole 20 ：1 25 ：1 30 ：1
Min core without copper thickness (um) 50 50 50
Finish Board Thickness (mm) 0.40~3.2 0.30~4.0 0.25~5.5
Laser Hole Filling Dimple (um) 10 8 5
Hole Tolerance (um) PTH ±50 ±50 ±40
NPTH ±0.025 ±0.025 ±0.025
Warpage ≤0.6% ≤0.5% ≤0.4%
CNC Routing Tolerance (um) Mass Production ±100 ±75 ±50
Sample Production ±50 ±50 ±50
Impedance Tolerance ±10% (±8%) ±8% ±8%
Line Capability (um) Line Width ~45 ~40 ~35
Line Space ~45 ~40 ~35
Min BGA Pad Size (um) 150 100 75
Min BGA Space (Pitch) 0.30mm 0.25mm 0.25mm